Field Application Engineer

Description

Summary: This role involves driving innovation in PCB and advanced packaging substrate technology by identifying customer opportunities, providing technical support, analyzing industry trends, and expanding market penetration. Highlights: 1. Key bridge between U.S. customers and a respected circuit solution provider 2. Leverage technical expertise to shape future innovation 3. Drive innovation in PCB and advanced packaging substrate technology Our client is a **world\-class electronic circuit solution provider** with over 35 years of history and global operations. As a trusted partner to leading communications, automotive, and medical equipment brands, they continues to drive **innovation in PCB and advanced packaging substrate technology**. To support our expansion in the U.S. market, we are looking to onboard a **Field Application Engineer** with deep knowledge of packaging substrates to **work remotely from California**. **Location:** Remote (must be based near or in California) **Employment Type:** Full\-time **Industry:** Semiconductor / PCB / Packaging Substrate **Languages:** English **Compensation:** $100,000–$150,000/year (based on experience) ### **️ Responsibilities:** Research and identify customer development opportunities across the United States Serve as the technical point of contact for customers, supporting product demand analysis and technical communication Analyze industry trends, product evolution, and customer feedback to guide development strategies Collect and interpret competitor intelligence to benchmark and position our offerings effectively Support the planning and participation in relevant trade shows and product exhibitions in the U.S. Build and expand customer acquisition channels to boost U.S. market penetration ### **Requirements:** 5\+ years of experience in the **packaging substrate industry** — with background in **process engineering, product development, or technical support** ️ Hands\-on knowledge of customer engagement and technical requirement management in **advanced PCB or packaging substrate companies** Must be **based in the United States** with **permanent residency** or equivalent legal work status Proactive, self\-driven, and confident in handling external communication with U.S. clients Strong interpersonal skills with the ability to interface effectively with R\&D and sales teams in China This is a **unique opportunity to be a key bridge between U.S. customers and one of Asia’s most respected circuit solution providers**. If you're ready to leverage your technical expertise and industry insights to shape future innovation — **apply now**! \#FieldApplicationEngineer \#PCBJobs \#PackagingSubstrate \#RemoteJobsUSA \#ElectronicsCareers \#SemiconductorIndustry \#TechJobsCalifornia \#ChineseTechGlobal